Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device fabrication
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United States of America Patent
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Jan 11, 2005
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N/A
app pub date -
Jul 21, 2000
filing date -
Apr 9, 1999
priority date (Note) -
Expired
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Abstract
In one embodiment of the invention, a method of manufacturing a semiconductor device comprises the steps of: a) providing an organic semiconductor layer; b) depositing a reactive species on a portion of the organic semiconductor layer; and c) reacting the reactive species with the portion of the organic layer to form a dielectric layer.
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