BLIND MATING APPARATUS
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United States of America Patent
Stats
-
Jan 25, 2005
Grant Date -
Feb 17, 2005
app pub date -
Aug 14, 2003
filing date -
Aug 14, 2003
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
A blind mating apparatus used in an expansion system has a first printed circuit board (PCB) and a second PCB. The first PCB has a resilient member and a housing sleeving the resilient member, and the second PCB has a contact member electrically connecting the resilient member. The blind mating apparatus further has a guiding member for guiding the resilient member and through which the resilient member penetrates. The contact member has a tolerance for correctly mating with the resilient member while the resilient member provides the contact member with a little bias.
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