Honeycomb structure thermal barrier coating
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United States of America Patent
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Jan 25, 2005
Grant Date -
Nov 21, 2002
app pub date -
May 16, 2001
filing date -
May 16, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A device having an improved thermal barrier coating (46) and a process for manufacturing the same. A support structure (28) for retaining a ceramic insulating material (46) on a substrate (16) is formed by the deposition of a support structure material through a patterned masking material (14). The support structure can define cells into which the ceramic insulating material is deposited following removal of the masking material. The masking material may be patterned by known photolithographic techniques (22,24) or by laser etching (48). The support structure (28) may be a composite metal-ceramic material having either discreet layers (30,34) or a graded composition and may be deposited by an electro-desposition process followed by a heat treatment to form a solid state diffusion bond with the substrate. The ceramic filler material may be deposited (44) by the electrophoretic deposition of ceramic particles coated with a bonding material that is subsequently heated to oxidize and to bond the particles together. The support structure may be provided with included walls in order to improve its resistance to foreign object impact damage.
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