Microelectronic package having a compliant layer with bumped protrusions
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United States of America Patent
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Jan 25, 2005
Grant Date -
Aug 1, 2002
app pub date -
Mar 26, 2002
filing date -
Oct 31, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic assembly includes a microelectronic element having a first surface with a plurality of contacts accessible at the first surface, and a compliant layer over the first surface of the microelectronic element, the compliant layer including a plurality of bumped protrusions and openings adjacent the bumped protrusions for providing access to the contacts, wherein each bumped protrusion includes a top surface and at least one sloping edge. The microelectronic assembly also includes conductive terminals over the top surfaces of the bumped protrusions, and a plurality of conductive bond ribbons having first ends in engagement with the contacts, second ends in engagement with the terminals and intermediate sections extending along the sloping edges for electrically interconnecting the contacts and the terminals.
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