Packaged semiconductor device for radio frequency shielding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 25, 2005
Grant Date -
Mar 6, 2003
app pub date -
Sep 6, 2001
filing date -
Sep 6, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.
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