Interconnect module with reduced power distribution impedance
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United States of America Patent
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Jan 25, 2005
Grant Date -
Jan 22, 2004
app pub date -
Jul 19, 2002
filing date -
Aug 24, 2001
priority date (Note) -
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Abstract
An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.
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