Barrier layers for microelectromechanical systems
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United States of America Patent
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Feb 1, 2005
Grant Date -
Sep 30, 2004
app pub date -
Mar 28, 2003
filing date -
Mar 28, 2003
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Abstract
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
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