System and method to form a composite film stack utilizing sequential deposition techniques
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 1, 2005
Grant Date -
Dec 26, 2002
app pub date -
Jun 20, 2001
filing date -
Jun 20, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method to form a stacked barrier layer for copper contacts formed on a substrate. The substrate is serially exposed to first and second reactive gases to form an adhesion layer. Then, the adhesion layer is serially exposed to third and fourth reactive gases to form a barrier layer adjacent to the adhesion layer. This is followed by deposition of a copper layer adjacent to the barrier layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully