Microelectronic assemblies with composite conductive elements
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United States of America Patent
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Feb 1, 2005
Issued Date -
N/A
app pub date -
Aug 29, 2001
filing date -
Feb 3, 1998
priority date (Note) -
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Abstract
A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect microelectronic elements. At the normal operating temperature of the assembly, the low-melting conductive material melts, allowing the cores and microelectronic elements to move relative to one another and relieve thermally-induced stress.
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