Electronic printed circuit board having a plurality of identically designed, housing-encapsulated semiconductor memories
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United States of America Patent
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-
Feb 1, 2005
Grant Date -
Jan 2, 2003
app pub date -
Jul 2, 2002
filing date -
Jul 2, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic printed circuit board has a memory module and a contact strip for insertion into another electronic unit. The memory module has at least nine identically designed housing-encapsulated integrated semiconductor memories configured on the printed circuit board. The longer dimension of the housing of one of the semiconductor memories, which is connected as an error correction chip, is oriented perpendicular to the contact strip. The longer dimension of the housings of the other semiconductor memories are oriented parallel to the contact strip. The different orientation of the semiconductor memories makes it possible to reduce the height of the printed circuit board while enabling the rectangular housings to keep the same physical form.
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