Method and apparatus for testing semiconductor wafers
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United States of America Patent
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Feb 1, 2005
Grant Date -
Apr 17, 2003
app pub date -
Aug 8, 2002
filing date -
Aug 22, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wafer testing apparatus comprises a sample chuck having a flat surface for supporting a test wafer positioned thereon, the sample chuck having a base structure manufactured of a conductive metal and having a semiconductor layer secured to the base structure defining the flat surface of the sample chuck, an electrical test probe establishing a correction factor corresponding to a location on the semiconductor layer surface to be used to report an electrical property at a location on a test wafer substantially unaffected by the electrical properties of the semiconductor layer and base structure below that location.
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