Encapsulated surface acoustic wave component and method of collective fabrication
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United States of America Patent
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Feb 8, 2005
Issued Date -
N/A
app pub date -
Oct 14, 2003
filing date -
Dec 8, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.
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