Method of assembling a semiconductor device package
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United States of America Patent
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Feb 8, 2005
Grant Date -
N/A
app pub date -
Apr 19, 2002
filing date -
May 31, 1999
priority date (Note) -
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Abstract
A method of assembling a semiconductor device package includes first attaching a semiconductor device to a die-pad area of a leadframe. Electrical connections are then between electrical contact areas on the semiconductor device and electrical connection areas on the leadframe to form a device/leadframe assembly. An adhesion enhancing coating is then deposited on the exposed surface of the device frame/leadframe assembly before encapsulating the coated device leadframe assembly in an electrically insulating material.
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