In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
5,359,020 Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers
5,470,920 Impregnating solutions based on at least one reactive thermoplastic poly (imide-amide) oligomer and a coreactant, which can be used especially for the production of preimpregnated intermediate articles
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