US Patent No: 6,852,814
Number of patents in Portfolio can not be more than 2000
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Stats
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Feb 8, 2005
Issued date -
Feb 25, 2002
filing date -
10/084,389
serial no -
In Force
status
Importance
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Abstract
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 4,886,842 Epoxy-amine compositions employing unsaturated imides | 19 | 1989 | |
| 5,358,992 Die-attach composition comprising polycyanate ester monomer | 41 | 1993 | |
| 5,447,988 Solvent free die-attach compositions | 43 | 1993 | |
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| 5,364,700 Prepregable resin composition and composite | 20 | 1985 | |
| 4,853,449 Bismaleimide formulations containing olefinic ether modifiers | 17 | 1988 | |
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| 5,359,020 Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers | 11 | 1991 | |
| 5,470,920 Impregnating solutions based on at least one reactive thermoplastic poly (imide-amide) oligomer and a coreactant, which can be used especially for the production of preimpregnated intermediate articles | 9 | 1993 | |
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| 5,527,592 Multilayer article having a planarized outer layer comprising a toughened polycyanurate | 17 | 1994 | |
| 5,599,611 Prepreg and cured laminate fabricated from a toughened polycyanurate | 18 | 1994 | |
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| 4,369,302 Curable resin composition comprising cyanate ester and polyisocyanate | 18 | 1980 | |
| 4,740,343 Method for producing rigid resin molds | 20 | 1987 | |
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| 4,766,179 Bismaleimide compositions | 10 | 1986 | |
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| 4,876,358 Oxyethylene bismaleimide derivatives | 17 | 1987 | |
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| 5,536,970 Resin-encapsulated semiconductor device | 35 | 1994 | |
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| 5,380,768 Foam, Foam-resin composite and method of making a foam-resin composite | 18 | 1993 | |
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| 5,475,048 Conductor-filled thermosetting resin | 31 | 1993 | |
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| 5,405,686 Article coated with kured homogeneous thermoset resin/thermoplastic particles | 17 | 1994 | |
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| 4,323,662 Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives | 42 | 1980 | |
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| 4,740,830 Low temperature single step curing polyimide adhesive | 23 | 1987 | |
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| 5,483,101 Multilayer printed circuit board | 27 | 1994 | |
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| 5,489,641 Freeze resistant die-attach compositions | 32 | 1993 | |
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| 5,442,039 Mesogenic polycyanates and thermosets thereof | 14 | 1993 | |
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| 4,564,663 Free radical cure of the bismaleimide of dimer diamine | 7 | 1985 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 8, 2016 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |