Thermosetting resin compositions containing maleimide and/or vinyl compounds

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6852814
APP PUB NO 20020193541A1
SERIAL NO

10084389

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HENKEL CORPORATIONROCKY HILL, CT104

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dershem, Stephen M San Diego, CA 93 2676
Osuna, Jr Jose A Albany, OR 11 444
Patterson, Dennis B Palmdale, CA 17 518

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
5527592 Multilayer article having a planarized outer layer comprising a toughened polycyanurate 17 1994
5599611 Prepreg and cured laminate fabricated from a toughened polycyanurate 18 1994
 
DSM RESINS BV (1)
* 4766179 Bismaleimide compositions 10 1986
 
Minnesota Mining and Manufacturing Company (1)
5405686 Article coated with kured homogeneous thermoset resin/thermoplastic particles 17 1994
 
LOCTITE CORPORATION (3)
* 4886842 Epoxy-amine compositions employing unsaturated imides 19 1989
* 5358992 Die-attach composition comprising polycyanate ester monomer 51 1993
* 5447988 Solvent free die-attach compositions 55 1993
 
LORD CORPORATION (1)
5475048 Conductor-filled thermosetting resin 31 1993
 
BP CORPORATION NORTH AMERICA INC. (2)
5364700 Prepregable resin composition and composite 21 1985
* 4853449 Bismaleimide formulations containing olefinic ether modifiers 19 1988
 
THE DOW CHEMICAL COMPANY (1)
5442039 Mesogenic polycyanates and thermosets thereof 68 1993
 
NEC CORPORATION (1)
5483101 Multilayer printed circuit board 28 1994
 
Huntsman Advanced Materials Americas Inc. (2)
5359020 Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers 11 1991
5470920 Impregnating solutions based on at least one reactive thermoplastic poly (imide-amide) oligomer and a coreactant, which can be used especially for the production of preimpregnated intermediate articles 10 1993
 
Mitsui Toatsu Chemicals, Incorporated (1)
* 4323662 Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives 42 1980
 
The United States of America as represented by the Secretary of the Navy (1)
* 4564663 Free radical cure of the bismaleimide of dimer diamine 7 1985
 
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (1)
* 4740830 Low temperature single step curing polyimide adhesive 23 1987
 
KABUSHIKI KAISHA TOSHIBA (1)
* 5536970 Resin-encapsulated semiconductor device 40 1994
 
QUANUM MATERIALS, INC. (1)
* 5489641 Freeze resistant die-attach compositions 41 1993
 
LOCKHEED MARTIN CORPORATION (1)
5380768 Foam, Foam-resin composite and method of making a foam-resin composite 18 1993
 
MITSUBISHI GAS CHEMICAL COMPANY, INC. (2)
* 4369302 Curable resin composition comprising cyanate ester and polyisocyanate 19 1980
* 4740343 Method for producing rigid resin molds 22 1987
 
HUNTSMAN CORPORATION (1)
* 4876358 Oxyethylene bismaleimide derivatives 18 1987
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Designer Molecules Inc, Inc. (2)
8686162 Maleimide-functional monomers in amorphous form 0 2011
* 8710682 Materials and methods for stress reduction in semiconductor wafer passivation layers 0 2013
 
DESIGNER MOLECULES, INC. (48)
7208566 Imide-linked maleimide and polymaleimide compounds 31 2004
* 2004/0225,026 Imide-linked maleimide and polymaleimide compounds 10 2004
7285613 Free-radical curable polyesters and methods for use thereof 30 2005
* 2005/0272,888 Free-radical curable polyesters and methods for use thereof 7 2005
7795362 Olefin oligomers containing pendant maleimide groups 9 2005
* 2006/0142,517 Olefin oligomers containing pendant maleimide groups 27 2005
8378017 Thermosetting adhesive compositions 1 2006
* 2007/0155,869 Mono-functional monomers and methods for use thereof 27 2006
7884174 Imide-linked maleimide and polymaleimide compounds 9 2007
7868113 Low shrinkage polyester thermosetting resins 9 2007
8043534 Maleimide compositions and methods for use thereof 9 2007
* 2008/0075,965 Maleimide compositions and methods for use thereof 30 2007
8530573 Modified calcium carbonate-filled adhesive compositions and methods for use thereof 1 2007
8287686 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 1 2007
* 2008/0017,308 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 28 2007
7875688 Free-radical curable polyesters and methods for use thereof 9 2007
* 2008/0210,375 Free-radical curable polyesters and methods for use thereof 27 2007
7786234 Free-radical curable polyesters and methods for use thereof 9 2007
* 2008/0191,173 Free-radical curable polyesters and methods for use thereof 27 2007
8344076 Hydrolytically resistant thermoset monomers 2 2007
7825188 Thermoplastic elastomer with acyloxyphenyl hard block segment 1 2007
* 2008/0142,158 HYDROLYTICALLY RESISTANT THERMOSET MONOMERS 27 2007
* 2008/0262,191 METHODS FOR THE PREPARATION OF IMIDES, MALEIMIDES AND MALEIMIDE-TERMINATED POLYIMIDE COMPOUNDS 29 2008
8039663 Monomers derived from pentacyclopentadecane dimethanol 9 2008
8063161 Low temperature curing acrylate and maleimide based formulations and methods for use thereof 2 2008
* 2010/0063,184 LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF 25 2008
7928153 Thermosetting polyether oligomers, compositions and methods for use thereof 10 2008
8398898 Soluble metal salts for use as conductivity promoters 1 2009
8541531 Anti-bleed compounds, compositions and methods for use thereof 1 2009
8308892 Di-cinnamyl compounds and methods for use thereof 1 2009
8637611 Amide-extended crosslinking compounds and methods for use thereof 1 2009
8217120 Functionalized styrene oligomers and polymers 1 2009
8158748 Hetero-functional compounds and methods for use thereof 1 2009
8013104 Thermosetting hyperbranched compositions and methods for use thereof 9 2009
8008419 Siloxane monomers and methods for use thereof 9 2009
* 2010/0041,803 THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF 28 2009
* 2010/0041,823 NOVEL SILOXANE MONOMERS AND METHODS FOR USE THEREOF 27 2009
* 2010/0041,832 FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS 27 2009
8288591 Curing agents for epoxy resins 1 2009
* 2010/0144,977 CURING AGENTS FOR EPOXY RESINS 10 2009
8431655 Curatives for epoxy compositions 2 2010
* 2010/0249,276 CURATIVES FOR EPOXY COMPOSITIONS 7 2010
8415812 Materials and methods for stress reduction in semiconductor wafer passivation layers 2 2010
* 2011/0049,731 MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS 3 2010
8513375 Imide-linked maleimide and polymaleimide compounds 1 2011
8816021 Curable composition with rubber-like properties 0 2011
* 2013/0228,901 MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS 2 2013
9278909 Amide-extended crosslinking compounds and methods for use thereof 0 2013
 
SCHLUMBERGER TECHNOLOGY CORPORATION (1)
* 2009/0200,013 WELL TUBULAR, COATING SYSTEM AND METHOD FOR OILFIELD APPLICATIONS 4 2009
* Cited By Examiner