Full area temperature controlled electrostatic chuck and method of fabricating same
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United States of America Patent
Stats
-
Feb 8, 2005
Grant Date -
May 2, 2002
app pub date -
Jun 13, 2001
filing date -
Jun 9, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor wafer support assembly and method of fabricating the same are provided. In one embodiment, the method and resulting assembly include attaching a pedestal joining-ring to a bottom surface of a ceramic puck. Low temperature brazing a composite cooling plate structure to the bottom surface of the ceramic puck, where the pedestal joining-ring circumscribes the composite cooling plate structure. Thereafter, a pedestal is electron-beam welded to the pedestal joining-ring.
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