Modification of circuit features that are interior to a packaged integrated circuit
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United States of America Patent
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Feb 15, 2005
Grant Date -
Jan 29, 2004
app pub date -
Jul 25, 2002
filing date -
Jul 25, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit feature that is interior to a packaged integrated circuit is modified by first identifying a trimming point on the interior circuit feature using an x-ray inspection system. Coordinates of the trimming point are then related to the coordinates of a visible reference marker. The relationship between the visible reference marker and the trimming point is then used to position a cutting tool over the trimming point. Finally, the cutting tool is used to make one or more cuts into the packaged integrated circuit, until the interior circuit feature has been acceptably modified at the trimming point.
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