Deposited film forming apparatus and deposited film forming method
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United States of America Patent
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Feb 15, 2005
Issued Date -
N/A
app pub date -
Sep 8, 2003
filing date -
Jan 31, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A deposited film forming apparatus has a power applying electrode disposed above a flat plate type base member grounded, in a vacuum chamber, and a power source for supplying a power to the power applying electrode, the deposited film forming apparatus being constructed to supply the power from the power source to the power applying electrode so as to generate a plasma in a discharge space between the power applying electrode and a substrate disposed in opposition to the power applying electrode in the vacuum chamber and serving as an electrode in a pair with the power applying electrode, thereby decomposing a source gas introduced into the vacuum chamber to form a deposited film on the substrate, wherein the power applying electrode is fixed to the base member with the power applying electrode being isolated from the base member.
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