Lithographic method and apparatus
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United States of America Patent
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Feb 15, 2005
Grant Date -
N/A
app pub date -
Sep 28, 2000
filing date -
Sep 29, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of imaging a pattern in a microlithographic exposure apparatus includes performing two exposures, each with a different mask, the superposition of the images defined by the two masks produces the complete circuit pattern. A dipolar illumination mode is used for each exposure, the dipoles of the two exposures being mutually perpendicular. The dipolar illumination mode of the first exposure is used to image mask features parallel to a first direction, and the dipolar illumination mode of the second exposure is used to image mask features perpendicular to the first direction.
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