Semiconductor devices having different package sizes made by using common parts
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 15, 2005
Grant Date -
Jan 2, 2003
app pub date -
Sep 3, 2002
filing date -
Jan 24, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.
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