Importance

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Abstract

A thermoelectric semiconductor module (10) includes a plurality of semiconductor pellets (14, 18) having Peltier characteristics are mechanically interconnected and arranged in an electrical series circuit with heat transferring means (12, 16, 20) with all interconnections being directly made. The means (12, 16, 20) can be of platelike construction with an L-shaped cross-section or, alternatively, with a U-shaped cross-section. A large number of modules (10) can be arranged in a two-dimensional or three-dimensional stack (30) with adjacent lines or planes of modules electrically interrelated by end segment connectors (32). In a further version, one side of a modular plane has heat exchanger fins (44-50) while the other side is electrically connected by ceramic segments (58) with deposited conductors (56). In yet another version, the modules are mounted onto rotating discs (94, 96) so as to act as a fluid impeller moving therepast enhancing thermal efficiency.

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First Claim