Microelectronic 3-D solenoid of circular cross-section and method for fabrication
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United States of America Patent
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Feb 15, 2005
Grant Date -
Mar 11, 2004
app pub date -
Sep 5, 2002
filing date -
Sep 5, 2002
priority date (Note) -
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Abstract
A microelectronic 3-dimensional solenoid of substantially circular or oval cross-section and a method for fabricating the solenoid. The solenoid is provided including a pre-processed semiconductor substrate, two supports upstanding from and spaced-apart on a top surface of the substrate, each support has a bottom end attached to the substrate. An inductor coil which has two spaced-apart ends each attached to one of two top ends of the two supports. The inductor coil is formed of a bi-layer metal laminate that has an inner metal layer and an outer metal layer. The outer metal layer is formed of a first metal that has a coefficient of thermal expansion larger than a coefficient of thermal expansion of a second metal that forms the inner metal layer.
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