Metal/ceramic bonding article and method for producing same
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United States of America Patent
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-
Feb 22, 2005
Grant Date -
Dec 18, 2003
app pub date -
Sep 25, 2002
filing date -
Jun 14, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.
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