Multi-directional wiring on a single metal layer
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United States of America Patent
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Feb 22, 2005
Grant Date -
N/A
app pub date -
Dec 7, 2000
filing date -
Dec 7, 2000
priority date (Note) -
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Abstract
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.
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