Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths
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United States of America Patent
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Mar 1, 2005
Grant Date -
Aug 1, 2002
app pub date -
Feb 12, 2002
filing date -
Oct 14, 1997
priority date (Note) -
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Abstract
A multilayer ceramic substrate has a first conductive pattern that is transfer-printed on a ceramic substrate using an intaglio plate made of a flexible resin. The intaglio plate has a plurality of grooves with different depts. A first insulation layer is on the first conductive pattern, and a second conductive pattern is on the insulating layer. The two conductive patterns are coupled by a via.
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