Ball grid array package with multiple interposers
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United States of America Patent
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-
Mar 1, 2005
Grant Date -
Aug 7, 2003
app pub date -
Oct 31, 2002
filing date -
Feb 1, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener. The second surface of the second stiffener is attached to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate. The plurality of contact pads are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.
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