Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
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United States of America Patent
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Mar 1, 2005
Issued Date -
N/A
app pub date -
Dec 11, 2002
filing date -
Jun 8, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for forming packaged substrates includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate which includes one or more flip-chip dice. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed.
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