Volumetrically efficient electronic circuit module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 1, 2005
Grant Date -
Feb 24, 2005
app pub date -
Aug 19, 2003
filing date -
Aug 19, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A miniaturized microelectronic, hybrid circuit package having either a single or a multi-layer, flexible, printed circuit substrate with printed conductors interconnecting a plurality of integrated circuit (IC) dies with a ball grid array (BGA) of contacts. The IC dies are arranged on parallel strips defined between preferential fold zones formed in the substrate. The dies are over molded with plastic that is shaped to facilitate the substrate being folded to form a polyhedron. When so folded, the over molded IC dies face inward and BGA is exposed on an outwardly facing surface to facilitate attachment of the folded package to a motherboard.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully