Importance

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Abstract

A method and apparatus for improving the performance of an edge launch electrical connector. Two or more edge vias are established along an edge face of a planar circuit module, such as a single- or multi-layer PCB, integrated circuit on a ceramic or organic substrate or a ceramic or organic package, thereby providing a short path from one or more of the substrate assembly's ground planes to a ground associated with the edge launch electrical connector, reducing jitter and providing a solution with low insertion and return losses. The two edge vias may be standard vias, castellations or wires or lines deposited, printed, painted, secured or put in contact with an edge face of the planar circuit module and are arranged at each side of the signal line thereby providing additional electromagnetic shielding. Optionally, an air line may be established to increase the operational cut-off frequency and/or improve electrical performance.

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First Claim