High-precision modeling filament
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United States of America Patent
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Mar 15, 2005
Grant Date -
Mar 27, 2003
app pub date -
Apr 17, 2002
filing date -
Sep 21, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is a modeling filament for use as feedstock in a fused deposition modeling liquifier, and a method for manufacturing the filament. The diameter and standard deviation of the filament are controlled to meet various tolerance requirements of jam resistance, slip resistance, model strength, liquifier overflow prevention and hysteresis-free transient response. Standard deviation of the filament diameter is matched to a filament target diameter. The resulting filament is used to form high-quality models.
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