Leadframe including corner leads and semiconductor package using same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6867071
SERIAL NO

10194557

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A leadframe comprising a frame body having four peripheral sides, each adjacent pair of which collectively defines a frame corner. Disposed within a central space or opening defined by the frame body is a die paddle including four peripheral edge segments, each adjacent pair of which collectively define a paddle corner. The leadframe also includes a plurality of tie bars, each of which comprises a first portion extending from a respective paddle corner of the die paddle and a second portion which extends angularly from the first portion and perpendicularly into connection with one of the sides of the frame body. Connected to and extending from the sides of the frame body toward and in spaced relation to respective ones of the peripheral edge segments of the die paddle are a plurality of leads. Additionally, connected to and extending from the sides of the frame body in close proximity to respective ones of the frame corners are a plurality of corner leads. Each of the corner leads extends in spaced, generally parallel relation to at least one of the peripheral edge segments of the die paddle.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTDVALLEY POINT #12-03

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Sung Sik Kyunggi-do, KR 9 154
Lee, Choon Heung Kyunggi-do, KR 44 1103
Yoo, Su Yol Seoul, KR 1 14

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