Manufacturing method of thin film transistor in which a total film thickness of silicon oxide films is defined
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United States of America Patent
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Mar 15, 2005
Grant Date -
Aug 7, 2003
app pub date -
Mar 3, 2003
filing date -
Oct 3, 1997
priority date (Note) -
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Abstract
On a transparent substrate to which a gate electrode is arranged, a silicon nitride film and a silicon oxide film to be gate insulating films are deposited, and further, a polycrystalline silicon film as a semiconductor film to be an active region is formed. On the polycrystalline silicon film corresponding to the gate electrode, a stopper is arranged, and a silicon oxide film and a silicon nitride film to be an interlayer insulating films are deposited so as to cover this stopper. The film thickness T0 of the stopper is set in a range of 800 angstroms to 1200 angstroms. Furthermore, the film thickness T0 of the stopper is set in the range to fulfill the following expression: T0+T1.ltoreq.(T2.times.8000 .ANG.){character pullout} where T1 is the film thickness of the silicon oxide film and T2 is the film thickness of the silicon nitride film.
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