Metal core integrated circuit package with electrically isolated regions and associated methods
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United States of America Patent
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Mar 15, 2005
Grant Date -
Jun 19, 2003
app pub date -
Dec 19, 2001
filing date -
Dec 19, 2001
priority date (Note) -
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Abstract
An integrated circuit chip package having a metal substrate core having two or more electrically isolated regions, wherein the electrically isolated regions of the metal substrate core may be coupled with voltage rails of an integrated circuit chip.
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