Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument
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United States of America Patent
Stats
-
Mar 15, 2005
Grant Date -
N/A
app pub date -
May 24, 2001
filing date -
Oct 1, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device including a substrate (10). An interconnect pattern (12) is formed over the substrate (10), and the substrate (10) has a first portion (14) and a second portion (16) to be superposed on the first portion (14). The first portion (14) has edges (22), (24), (26) and (28) as positioning references. The second portion (16) has a shape to be superposed over the first portion (14) except the edges (22), (24), (26) and (28).
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