Encapsulated organic electronic devices and method for making same
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United States of America Patent
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Mar 15, 2005
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N/A
app pub date -
Jul 12, 2000
filing date -
Jul 12, 2000
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Abstract
Encapsulated organic electronic devices including organic light emitting diodes are made using an adhesive component as a mask while the device is being constructed. An adhesive-coated liner can be applied to the device substrate and openings created therein by removing portions of the linear and adhesive, or a patterned adhesive layer having openings therein can be formed on the device substrate, followed by deposition of the device layers and application of a sealing layer.
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