Method of forming bumps
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United States of America Patent
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Mar 22, 2005
Issued Date -
N/A
app pub date -
May 28, 2002
filing date -
May 29, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
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