Fluid interconnect for printhead assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6869165
APP PUB NO 20040085394A1
SERIAL NO

10283836

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Abstract

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A printhead assembly includes a carrier having a fluid manifold defined therein such that the fluid manifold includes a first chamber and a second chamber; a plurality of printhead dies each mounted on the carrier and communicating with at least one of the first chamber and the second chamber of the fluid manifold; a fluid delivery assembly coupled with the carrier and including a first chamber and a second chamber; and a fluid interconnect fluidically coupling the first chamber of the fluid manifold with the first chamber of the fluid delivery assembly and the second chamber of the fluid manifold with the second chamber of the fluid delivery assembly.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD COMPANYPALO ALTO CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Martin, Michael Dana Point, CA 151 1750

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