Material and method for three-dimensional modeling
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United States of America Patent
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Mar 22, 2005
Grant Date -
Nov 11, 2004
app pub date -
May 5, 2003
filing date -
May 5, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is a modeling technique wherein a three-dimensional model and its support structure are built by fused deposition modeling, using a thermoplastic blended material containing a polyphenylsulfone (PPSF) polymer and a polycarbonate (PC) polymer to form the model. The PPSF/PC blend exhibits good chemical resistance, thermal stability, and resists build-up in the nozzle of a three-dimensional modeling apparatus. Removal of the support structure from a completed model is facilitated by operating on the material while it is hot.
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