Folded BGA package design with shortened communication paths and more electrical routing flexibility
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United States of America Patent
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Mar 22, 2005
Grant Date -
Jul 1, 2004
app pub date -
Dec 31, 2002
filing date -
Dec 31, 2002
priority date (Note) -
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Abstract
A method and apparatus for making a multiply folded BGA package design with shortened communication paths and more electrical routing flexibility. A package apparatus includes a substrate and a first integrated circuit (IC), wherein the first IC is electrically connected to the first face of the substrate, and wherein a first segment and a second segment of the substrate are both folded around the first IC. A second IC is electrically connected to the second face of the substrate, such that the second IC is connected to the first and second folded segments of the substrate abode the first IC.
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