Off-center solder ball attach assembly
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United States of America Patent
Stats
-
Mar 22, 2005
Grant Date -
Aug 29, 2002
app pub date -
Feb 15, 2002
filing date -
Mar 8, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A connection component includes a dielectric element having a first surface and a second surface, and conductive pads on the first surface of the dielectric element, each conductive pad having a center. The connection component also includes conductive vias electrically connected to the conductive pads and extending toward the second surface of the dielectric element, each of the vias having an opening at one of the conductive pads. At least one of the via openings is offset from the center of at least one of the conductive pads.
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