Insulative covering of probe tips
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United States of America Patent
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-
Mar 22, 2005
Grant Date -
Dec 30, 2004
app pub date -
Jun 27, 2003
filing date -
Jun 27, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An insulative material is applied to one or more selected probe tips to disable those probes, and the probes are brought into contact with a semiconductor die. One or more tests are run on the die to verify sufficient testing of the die without the disabled probes. The process may be repeated with other probes disabled to determine which probes need not be used in testing the die.
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