Chemical mechanical polishing composition and process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 29, 2005
Grant Date -
Mar 14, 2002
app pub date -
Apr 25, 2001
filing date -
Jul 28, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and composition for planarizing a substrate surface is provided. The polishing composition includes an oxidizer capable of oxidizing a metal undergoing planarization and yielding a complexing agent which complexes with the oxidized metal and a stabilizer such as a stannate salt. The composition may further include abrasive particles and/or inhibitors. The composition may be used in a multi-step polishing process including polishing a substrate surface to selectively remove a metal layer with respect to a barrier layer and dielectric layer and polishing a substrate surface using the composition to non-selectively remove the metal layer, a barrier layer, and a dielectric layer from the substrate surface.
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