Substrate with recessed surface portion
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United States of America Patent
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-
Mar 29, 2005
Grant Date -
Jun 19, 2003
app pub date -
Dec 19, 2001
filing date -
Dec 19, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus including: (a) a substrate including a deposition region and an optional uncoated region, wherein the deposition region includes a level intermediate region disposed between a first end region and a second end region, wherein the first end region includes a first recessed surface portion that increases the surface area of the first end region, wherein the first recessed surface portion is recessed below the level intermediate region, wherein the surface area of the first end region is greater by at least about 5% than the surface area of a hypothetical level first end region; and (b) a dip coated layer over the entire deposition region.
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