Method of sealing a hermetic lid to a semiconductor die at an angle
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United States of America Patent
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Mar 29, 2005
Issued Date -
N/A
app pub date -
Jun 24, 2002
filing date -
Jul 29, 1998
priority date (Note) -
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Abstract
The current invention provides a optical MEM device and system with an angled lid for hermetically sealing an active MEMS structure. The lid is sealed through an asymmetric seal formed with sealing rings having an asymmetric distribution of solder wetting surfaces which tilts the lid, when the lid and a substrate are soldered together. The asymmetric distribution wetting surfaces can be provided by forming one or more edge features, by patterning portions of the sealing rings or both. Preferably, the lid is transparent to one or more wavelengths of light in a range of 300 to 3000 Angstroms and hermetically seals a grating light valve structure having a plurality of movable ribbon for modulating light through the lid.
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