Power semiconductor package with strap
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United States of America Patent
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Mar 29, 2005
Issued Date -
N/A
app pub date -
Jul 11, 2003
filing date -
Nov 7, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.
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