Method for manufacturing printed circuit board
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United States of America Patent
Stats
-
Apr 5, 2005
Grant Date -
Apr 29, 2004
app pub date -
Jul 9, 2003
filing date -
Jul 12, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
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