Semiconductor device and contractor for inspection
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United States of America Patent
Stats
-
Apr 5, 2005
Issued Date -
N/A
app pub date -
Oct 1, 2002
filing date -
Mar 17, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device superior in heat dissipation in which the exchanging of chips can be readily performed is realized by mounting, through means distinct from bonding or connecting, a LSI chip on an interconnection substrate having substantially no difference in thermal conductivity between the LSI chip and the substrate. The semiconductor device is provided on an interconnection substrate 6 with electrode terminals 7 of cantilever structure, an interconnection layer 8 for electrical connection among the electrode terminals 7, an interconnection layer 12 for electrical connection to outer portions, and fitting portions 9 formed in a cover 5, the substrate 6 and the cover 5 being connected by the fitting portions. The chips 1 and 2 are electrically contacted through the terminals 7 without using any bonding or connecting, so that the mounting and detachment of the cover 5 and the substrate can be readily performed.
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