MEMS device having contact and standoff bumps and related methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 5, 2005
Grant Date -
Jun 26, 2003
app pub date -
Nov 8, 2002
filing date -
Nov 9, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
MEMS Device Having Contact and Standoff Bumps and Related Methods. According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully