Lid assembly for a processing system to facilitate sequential deposition techniques
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United States of America Patent
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Apr 12, 2005
Issued Date -
N/A
app pub date -
Dec 12, 2001
filing date -
Jul 16, 2001
priority date (Note) -
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Abstract
A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having a gas manifold mounted on a first side and a baffle plate mounted on a second side. The gas manifold is configured to deliver a plurality of gases to a plenum defined between the baffle plate and the lid. The gases are mixed within a recess formed in the baffle plate before exiting into the processing system through a singular passage.
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