Substrate processing method and substrate processing system
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United States of America Patent
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Apr 12, 2005
Grant Date -
Mar 6, 2003
app pub date -
Aug 30, 2002
filing date -
Sep 3, 2001
priority date (Note) -
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Abstract
The present invention controls a temperature of a processing liquid to be in within an allowable processing temperature range, whereby the processing efficiency and throughputs can be improved, deterioration of the processing liquid is prevented, and the life of the processing liquid can be extended. In the liquid processing method, a chemical liquid L stored in a tank 10 can have temperatures controlled by heating and cooling by a heater 1 and cooling means 2 and is circulated for stand-by. the chemical liquid L in the stand-by circulation is supplied to wafers loaded in a processing chamber 6 to process the wafers, a cooling medium of the cooling means 2 is heat-exchanged with the chemical liquid L in the tank 10 to be ready for the next stand-by circulation.
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