One-part solvent-based adhesive for bonding polymer materials
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United States of America Patent
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Apr 12, 2005
Grant Date -
Sep 2, 2004
app pub date -
Feb 28, 2003
filing date -
Feb 28, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
What is disclosed are adhesives and bonding methods employing a single coat of a solvent-based adhesive that effectively bonds thermoplastic polymers and especially thermoplastic elastomers. The adhesive components are a organosilane component selected from organosilane-isocyanate adduct and isocyanato-organosilane, a post-chlorinated polymer containing propylene repeating units or derivative thereof, and solvent. Also disclosed are methods for joining a rigid, structural substrate to a molten polymer such as a TPE via injection molding or extrusion. Durable adhesion between the adhesive treated portion of the rigid substrate and the melt-processed polymer is achieved with or without a previous heat treatment on the adhesive-coated substrate prior to joining to the thermoplastic melt.
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